New Video Addresses FOD Prevention in Electronics Assembly

Preventing FOD in Electronics AssemblyIPC has released a new program that focuses exclusively on FOD Prevention in Electronics Assembly.

Foreign Objects and Debris (FOD) can severely affect the reliability and functionality of electronic devices. This new IPC training video provides the information and techniques to help eliminate FOD during electronics assembly, including hand soldering, SMT & PTH assembly processes, and box build / wire assembly.

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